ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

Glass has become a central element in modern architecture with the introduction of new strategies for designing and experiencing buildings. Its transparency and material composition allow for ...

Currently, MPC solutions include solutions for linearity, but not for uniformity, leaving the door open for mask variation that leads to wafer variation ... amount of etching to the side is inevitable ...

Gorilla Armor 2 was launched this month, and it’s the latest version of the popular scratch-resistant glass for smartphones and tablets. The tech has been available for over a decade now ...

China's wafer foundry industry will generate US$13.22 billion in revenue in 2024, representing a 16% year-on-year growth, slightly exceeding the global growth rate of 14%. The revenue momentum of ...

Despite this resilience, the earthquake may have affected between 10,000 to 20,000 wafers currently in production. These wafers are critical for TSMC's operations, particularly within its advanced ...

At the same time, cutting-edge techniques like hybrid bonding and wafer thinning are enabling new levels of integration ... and it is developing new ways to manage higher power density in a smaller ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...