With this package, military and aerospace customers have the flexibility to use their proprietary or preferred-vendor technology to attach columns or solder balls to the LGA package. Customers will ...

With MagI³C-VDLM, Würth Elektronik introduces three power modules in the LGA-12EP package tailored for the 24 V industrial power bus. These modules stand out for their exceptional resilience to ...

The Global Ambassador in Phoenix is offering what it's calling a "super-luxe" package to the 2025 WM Phoenix Open and TPC Scottsdale that is taking things to the level beyond the next level.

The Global Ambassador in Phoenix is offering what it's calling a "super-luxe" package to the 2025 WM Phoenix Open and TPC Scottsdale that is taking things to the level beyond the next level. This ...

DDR4 ball grid array package develops partial connection defect during device operation. Electrical model of defect is presented and Ansys software is used to extract resistance, inductance and ...

In this 3D integration scenario, an important differentiator is that interposers and 3D chip stacks are still attached to BGA and LGA packages, which then are mounted to the PCB. These interposers are ...

Ponkikki” (Open! Ponkikki), or the package illustration of Tohato Inc.’s snack food Caramel Corn. “We appreciate that because we have received many positive comments from, for example ...