The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder b… ...

Spirit Electronics' precision BGA reball process provides solder ball exchange with automated technology for high reliability solutions.

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – sol… ...

The Ball Grid Array (BGA) Packaging Market delves into various aspects, enabling readers to gain a deep understanding of the market dynamics, trends and potential opportunities. Report Ocean, a ...

However, the use of non-solder-mask defined (NSMD) pads becomes that much more important with BGA pad sizes that are less than the ball sizes. Statistically, solder joints on the NSMD pads are about ...

BGA packages come in various sizes with solder ball dimensions to fit the application. In reflow soldering, the solder balls melt when the PCB assembly reaches the required temperature. Surface ...

The Bermuda Golf Association’s Four-Ball Championships got underway at the Port Royal Golf Course. Jarryd Dillas and Damain Palanyandi are the first round leaders at 3-under par, and the team of ...

The challenges can be managed by carefully controlling the PCB handling processes and then strengthening the thin PCB with design solutions.

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...