Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised surface mount components in consumer electronics which operates in high-temperature ambient is studied.

Wirebonding performed at elevated temperatures is the standard interconnect process for integrated circuits, typically with the use of low-cost copper bonding wire. However, for specific applications ...