Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised surface mount components in consumer electronics which operates in high-temperature ambient is studied.

LBW: Where the ball strikes the pad Batsmen can create doubt in an umpire's mind by taking a big stride down the pitch with their front foot. By moving further down the pitch, the batsman lengthens ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...

High-speed short-range wireless communication systems are expected to utilize the 60-GHz band. This paper presents a bonding wire loop antenna in a standard ball grid array (BGA) package for 60-GHz ...

Get powerful, Hot Bga Balls Soldering On The Pcb Heated By Bga Rework Station Closeup Macro pre-shot video to fit your next project or storyboard.