EurekAlert!2mon
Dry etching area in the Fraunhofer IAF clean room (IMAGE)
As part of the APECS pilot line, the area of dry etching technology in the Fraunhofer IAF clean room for 6’’ wafers is being expanded.
AZOM3y
High-Density Plasma to Achieve Fast Etching and Deposition Rates—PlasmaPro 100 Cobra
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The PlasmaPro 100 Cobra ICP RIE system ...
AZOM1y
Reactive Ion Etching (RIE) — PlasmaPro 100 RIE
Reactive Ion Etch (RIE) is a physical etch process. A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch.