This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...

Georgia's Parker Jones was flagged for interfering with an official during the Sugar Bowl.

The challenges can be managed by carefully controlling the PCB handling processes and then strengthening the thin PCB with design solutions.

Add some ball grid array (BGA) chips into the mix, where the solder joints are not visible by design, and inspection is more a leap of faith than objective proof of results.

Ball Grid Array (BGA) packaging is a game-changer in electronics. Unlike traditional packaging methods, BGA replaces pins with solder balls, significantly improving the connection between the ...

This novel approach is an extension of "balls shifted as needed" method for I/O ball placement in BGA package enabling single-layer board-level routing for any I/O count. The I/O ball/pad layout and ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – sol… ...

Spirit Electronics' precision BGA reball process provides solder ball exchange with automated technology for high reliability solutions.

BGA packages come in various sizes with solder ball dimensions to fit the application. In reflow soldering, the solder balls melt when the PCB assembly reaches the required temperature. Surface ...