Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

The remaining $3B will go towards advanced research towards packaging, silicon photonics and next-generation gallium nitride, a compound used for semiconductors, GlobalFoundries added.

Advanced packaging for AI chiplet integration The first evolution in AI hardware focuses on using advanced HI packaging to integrate chiplets from diverse wafer nodes, particularly for integrating ...

GlobalFoundries to create new silicon photonics facility 22 Jan 2025 Major investment to on-shore packaging, test, and assembly capabilities at Malta, New York, location.

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center.

Additionally, the company has announced funding for its newly launched New York Advanced Packaging and Photonics Centre, the first US-based facility dedicated to silicon photonics packaging.

TSMC's new silicon photonics work is improving: its first co-packaged optics (CPO) samples expected to reach NVIDIA, Broadcom in 2025.

The new silicon photonics center will expand the firm’s advanced packaging capabilities, where bare chips are converted into individual packages ready for end-product use, thus providing customers ...

Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power ...

The remaining $3B will go towards advanced research towards packaging, silicon photonics and next-generation gallium nitride, a compound used for semiconductors, GlobalFoundries added.

Advanced packaging, assembly and testing for GF’ s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power ...