The underside of the chip has twelve tiny solder balls in a staggered 4×6 array with 0.4 mm pitch. [mitxela] tackled the job of soldering this chip to a 2.54-mm pitch breakout board using ...

On an SO-DIMM, it’s relatively limited bandwidth; while when you solder the memory chips onto the board, you can build it for a much wider bandwidth. And with things like the modern chips with ...

These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...

Difficult to solder in place, but the result is a QFP footprint to which the chip can be attached. We like it, it’s much more elegant than elite dead-bug soldering!